NASHVILLE, TN – International FemtoScience, Inc. (FemtoSci), a pioneer in diamond-based technologies for extreme environments, has been selected to present Laser Fabrication of Monolithic Capacitors Internal to Diamond for Extreme Temperature Performance at the International Microelectronics Assembly and Packaging Society (IMAPS) International Conference on Advanced Packaging for Power Electronics.

The conference will be held April 14-17, 2025, in Albuquerque, New Mexico. The invitation recognizes FemtoSci's groundbreaking work in developing diamond-based electronic components that can withstand extreme conditions, including high temperatures and radiation environments where conventional silicon-based electronics fail."

This invitation highlights the industry's recognition of our innovative approach to creating ultra-high-performance capacitors using our proprietary diamond fabrication methods," said Dr. Jim Davidson, President of FemtoSci. "Our monolithic diamond capacitors represent a significant advancement for electronics in aerospace, defense, and energy applications where reliable operation in harsh environments is critical."

FemtoSci's laser fabrication technique creates embedded capacitor structures within diamond substrates, achieving unprecedented temperature stability, energy density, and reliability. These capacitors maintain consistent performance at temperatures exceeding 500°C, making them ideal for next-generation power electronics in electric vehicles, aerospace systems, and defense applications.

The paper, to be presented by John Fraley of Missionshire, details the fabrication process, performance metrics, and potential applications of this groundbreaking technology. IMAPS selected FemtoSci's paper as one of a limited number of invited presentations due to its potential to transform power electronics packaging for extreme environment applications.

The IMAPS International Conference on Advanced Packaging for Power Electronics brings together leading researchers, engineers, and industry professionals to discuss cutting-edge developments in microelectronics packaging and assembly.

As the premier non-profit membership association in microelectronics, IMAPS plays a vital role in steering academic, industrial, and governmental collaboration in advanced packaging technologies.

About IMAPS: The International Microelectronics Assembly and Packaging Society (IMAPS) is the premier non-profit membership association steering the communities associated with Microelectronics Advanced Packaging, Interconnect and Assembly. IMAPS provides channels for communicating, educating, and interacting within academia, industry, and government. For more information, visit https://imaps.org/page/About-Us.