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IMAPS Invites FemtoSci to Present on Advanced Packaging for Power Electronics

FemtoSci has been chosen to present at the International Microelectronics Assembly and Packaging Society (IMAPS) International Conference on Advanced Packaging for Power Electronics.

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FemtoSci Secures Defense Contract and Funding, Advancing Diamond-Based Electronics in Tennessee

FemtoSci expands next-gen diamond semiconductor manufacturing in Tennessee, advancing defense capabilities with support from Launch Tennessee.

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Materials Research Science and Engineering Center Names FemtoSci as Key Industry Partner

The National Science Foundation funded Materials Research Science and Engineering Center (MRSEC) program has selected FemtoSci as a key industry partner.

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